Book Authorship and Editorship (chronological order):
- Hoang, H.H., Schutz, R., Bernstein, J.B., Vasquez, B., Multilevel Interconnection: Issues that Impact Competitiveness, Proceedings of SPIE 2090, 1993
- Pecht, M., Bernstein, J.B., Searls, D., and Peckerar, M., The Korean Electronics Industry, CRC Press, 1997.
- Mark White, Joseph B. Bernstein, Microelectronics Reliability Modeling and Lifetime Evaluation Handbook: Derating and Reliability Prediction Guidelines, NASA JPL Publication, 2007
- Joseph B. Bernstein et.al, Physics-of-Failure Based Handbook of Microelectronic Systems, Reliability Information Analysis Center, Utica, NY, 2008 ISBN-10: 1-933904-29-1
Book Chapters:
- Stark, B., Bernstein, J.B., " Reliability Overview," MEMS Reliability Assurance Guidelines for Space Applications, NASA Publication, 1998
- Bernstein, J.B., "Laser Link-Making," in LIA Handbook of Laser Materials Processing, Magnolia Publishing, 2001.
Articles in Refereed Journals:
- Bernstein, J.B., “Analysis of the electrically stimulated acoustic-wave method for observing space charge in semi-insulating films," Physical Review B (Condensed Matter), vol.44, no.19, pp. 10804-14 (1991)
- Bernstein, J.B., Cooke, C.M., "Bulk space charge behavior in polymethylethacrylate under an imposed virtual cathode condition," IEEE Transactions on Electrical Insulation, vol. 26, no. 6, pp. 1080-6 (1991)
- Bernstein, J.B., Cooke, C.M., "Electric poling behavior of polymethylmethacrylate," IEEE Transactions on Electrical Insulation, vol. 26, no. 6, pp. 1087-93 (1991)
- Cohen, S.S., Wyatt, P.W., Bernstein, J.B., “Laser-induced melting of thin conducting films. II. Heat-dissipating substrates," IEEE Transactions on Electron Devices, vol.38, no.9 pp. 2051-7 (1991)
- Cohen, S.S., Wyatt, P.W., Burns, J.A., Bernstein, J.B., “The mechanism of laser-induced vertical links," Journal of the Electrochemical Society, vol.138, no.10, pp. 3013-18 (1991)
- Bernstein, J.B., "Improvements to the Electrically Stimulated Acoustic Wave method for analyzing bulk space charge," IEEE Transactions on Electrical Insulation, vol. 27, no.1, pp. 152-61 (1992)
- Bernstein, J.B., Cohen, S.S., Wyatt, P.W., "Metal wire cutting by repeated application of low-power laser pulses," Review of Scientific Instruments, vol. 63, no. 6, pp. 3516-18 (1992)
- Cohen, S.S., Bernstein, J.B., Wyatt, P.W., "The effect of multiple laser pluses on damage to thin metallic films," Journal of Applied Physics, vol. 71, no. 2, pp. 630-7 (1992)
- Cohen, S.S., Bernstein, J.B., Wyatt, P.W., "Laser-induced line melting and cutting," IEEE Transactions on Electron Devices, vol. 39, no. 11, pp. 2480-5 (1992)
- Murguia, J.E., Bernstein, J.B., "Short-time failure of metal interconnect caused by current pulses," IEEE Electron Device Letters, vol. 14, no. 10, pp. 481-3 (1993)
- Bernstein, J.B., Ventura, T.M., Radomski, A.I., "High-density laser linking of metal interconnect," IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 17, no.4, pp. 590-3 (1994)
- Bernstein, J.B., Ventura, T.M., Radomski, A.T., "Laser induced microfracture leading to high density metal-to-metal connections," Proceedings of the SPIE, The International Society for Optical Engineering, vol. 2335, pp. 165-76 (1995)
- Bernstein, J.B., Colella, B.D., "Laser-formed metallic connections employing a lateral link structure," IEEE Transaction on Components, Packaging, and Manufacturing Technology, Part A, vol. 18, no. 3, pp.690-2 (1995)
- Shen, Y-L, Suresh, S., Bernstein, J.B., "Laser linking of metal interconnect: analysis and design considerations," IEEE Transactions on Electron Devices, vol. 43, no. 3, pp. 402-10 (1996)
- Rasera, R.L., Bernstein, J.B., "Laser linking of metal interconnect: linking dynamics and failure analysis," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 19, no. 4, pp. 554-61 (1996)
- Bernstein, J.B., Hua, Y., Zhang, W., "Laser energy limitation for buried metal cuts," IEEE Electron Device Letters, vol. 19, no. 1, pp. 4-6 (1998)
- Bernstein, J.B., Zhang, W., Nicholas, C.H., "Laser formed metallic connections," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 21, no. 2, pp. 194-8 (1998)
- Chen, Y., Suehle, J.S., Shen, C.C., Bernstein, J.B., Messick, C., Chaparala, P., "A new technique for determining long-term TDDB acceleration parameters of thin gate oxides," IEEE Electron Device Letters, vol. 19, no. 7, pp. 218-21 (1998)
- Zhang, W., Lee, J.H., Chen, Y., Bernstein, J.B., Suehle, J.S., "Reliability of laser-induced metallic vertical links," IEEE Transactions on Advanced Packaging, vol. 22, no.4, pp. 614-19 (1999)
- Shen, C.C., Hefner, A.R., Jr., Berning, D.W., Bernstein, J.B., "Failure Dynamics of the IGBT During Turn-off For Unclamped Inductive Loading Conditions," IEEE Transactions on Industry Applications, Vol. 36, no.2, pp.614-24 (2000)
- Bernstein, J.B., Lee, J., Yang, G., Dahmas, T., “Analysis of Laser Metal-Cut Energy Process Window," IEEE Transactions on Semiconductor Manufacturing, vol.13, no. 2, pp. 228-34 (2000)
- Vogel, E., Suehle, J.S., Edelstein, M.D., Wang, B., Chen, Y., Bernstein, J.B., “Reliability of Ultra-thin Silicon Dioxide Under Combined Substrate Hot Electron and Constant Voltage Tunneling Stress," IEEE Transactions on Electron Devices, vol. 47, no.6, pp.1183-91 (2000)
- Lee, J., Zhang, W., Bernstein, J.B., “Scalability Study of Laser-induced Vertical Make-link Structure," IEEE Transactions on Semiconductor Manufacturing, vol. 13, no. 4, pp. 442-447 (2000)
- Yang, L., Bernstein, J.B., Chung, K, "The Impact of Lead-free Soldering on Electronics packages," Microelectronics International, vol. 18, no. 3, pp. 20-26 (2001)
- Wang, B., Suehle J.S. ,Vogel E.M., Bernstein, J.B., "Time-Dependent Breakdown of Ultra-thin SiO2 Gate Dielectrics under Pulsed Biased Stress," IEEE Electron Device Letters, vol. 22, no. 5, pp. 224-226 (2001)
- Zhang, W., J.-H. Lee, Bernstein, J.B, "Energy Effect of the Laser Induced Vertical Metallic Link," IEEE Transactions on Semiconductor Manufacturing, vol. 14, no. 2, pp. 163-169 (2001)
- J.F. Conley Jr., J.S. Suehle, A.H. Johnston, B.Wang, T. Miyahara, E.M. Vogel, J.B. Bernstein, "Heavy-Ion Induced soft breakdown of thin gate oxides," IEEE Transactions on Nuclear Science, vol. 48, no. 6, pp. 1913-16 (Dec. 2001)
- J.S. Suehle, E.M. Vogel, P. Roitman, J.F. Conley Jr., A.H. Johnston, B. Wang, J.B. Bernstein, and C.E. Weintraub, "Observation of Latent Reliability Degradation in Ultra-Thin Oxides after Heavy-Ion Irradiation," Applied Physics letters, vol. 80, no. 7, pp. 1282-4 (18 Feb 2002)
- E.M., Vogel, D. Heh, J.B. Bernstein, "Interaction between low-energy electrons and defects created by hot holes in ultrathin Silicon Dioxide," Applied Physics letters, vol. 80, no. 18, pp. 3343-5 (6 May 2002)
- L.-S. Yang and J.B. Bernstein, "Encapsulation Process Development for Flexible-Circuit Based Chip Scale Packages," IEEE Trans. Electronics Packaging Manufacturing, vol. 25, no. 4, pp. 344-354 (October 2002)
- L.-S. Yang, J.B. Bernstein and K.C. Leong, "Effect of the Plasma Cleaning Process on Plastic Ball Grid Array Package Assembly Reliability," IEEE Trans. Electronics Packaging Manufacturing, vol. 25, no. 2, pp. 91-99 (April 2002)
- E.M., Vogel, D. Heh, J.B. Bernstein, J.S. Suehle, "Impact of the Trapping of Anode Holes in Silicon Dioxide Breakdown," IEEE Electron Device Letters, vol. 23, no. 11, pp. 667-669 (November 2002)
- J. Lee, W. Zhang, J.B Bernstein, "Analysis of Energy Process Window of Laser Metal Pad Cut Link Structure," IEEE Transactions on Semiconductor Manufacturing, vol. 16, no. 2, pp. 299-307 (2003)
- L. Yang, C.K. King, J.B. Bernstein, “Liquid Dispensing Encapsulation in Semiconductor Packaging,” Microelectronics International, vol. 20, no. 3, pp. 29-35 (2003)
- D.W. Heh, E.M. Vogel, J.B. Bernstein, “Impact of Substrate Hot Hole Injection on Ultra-thin Silicon-dioxide Breakdown, ”Applied Physics Letters, vol. 82, no. 19, pp. 3242-3244 (2003)
- J.S. Suehle, B. Zhu, Y. Chen and J.B. Bernstein, “Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides,” Microelectronics Reliability, vol. 45, pp. 419-426 (2005)
- Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, J?rg Walters, Yoram Shapira and Michael Talmor, “Electronic circuit reliability modeling,” Microelectronics Reliability, vol. 46, pp. 1957-1979 (2006)
- Heh D, Young CD, Brown GA, Hung PY, Diebold A, Bersuker G, Vogel EM, Bernstein JB, “Spatial distributions of trapping centers in HfO2/SiO2 gate stacks,” Applied Physics Letters, vol. 88, no.15, pp. 152907 (2006)
- X. Li, J. Qin, B. Huang, X. Zhang, and J.B. Bernstein, “SRAM Circuit Failure Modeling and Reliability Simulation with SPICE,” IEEE Trans. on Device and Mat. Rel., vol. 6, no. 2, pp.235-246 (2006)
- X. Li, J. Qin, B. Huang, X. Zhang, and J.B. Bernstein, “A New SPICE Reliability Simulation Method for Deep Submicron VLSI Circuits,” IEEE Trans. on Device and Mat. Rel., vol. 6, no. 2, pp. 247-257 (2006)
- D. Heh, C.D. Young, G.A. Brown, P.Y. Hung, A. Diebold, E. Vogel, J.B. Bernstein, and G. Bersuker, “Spatial Distributions of Trapping Centers in Hf02/SiO2 Gate Stack," IEEE Transactions on Electron Devices, vol. 54, no.6, pp. 1338-45 (2007)
- X. Li, J. Qin, and J.B. Bernstein, “Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation,” IEEE Trans. on Device and Mat. Rel., vol. 8, no. 1, pp. 98-121 (2008)
- M. Gurfinkel, H.D. Xiong, K.P. Cheung, J.S. Suehle, J.B. Bernstein, Y. Shapira, A.J. Lelis, D. Habersat, N. Goldsman, “Characterization of Transient Gate Oxide Trapping in SiC MOSFETs Using Fast I-V Techniques,” IEEE Transactions on Electron Devices, vol. 55, no.8, pp. 2004-12 (2008)
- L. Yang, J.B. Bernstein, "Reliability Study of High-Density EBGA Packages Using the Cu Metalized Silicon," IEEE Transaction on Components and Packaging Technology, vol. 31, no. 3, pp. 702-11 (2008)
- M. Gurfinkel, J.C. Horst, J.S. Suehle, J.B. Bernstein, Y. Shapira, K.S. Matocha, G. Dunne, R.A. Beaupre, “Time-Dependent Dielectric Breakdown of 4H-SiC/SiO2 MOS Capacitors,” IEEE Trans. on Device and Mat. Rel., vol. 8, no. 4, pp. 635-641 (2008)
- B. Yan, J. Qin, J. Dai, Q. Fan, and J.B. Bernstein, “Reliability Simulation and Circuit-Failure Analysis in Analog and Mixed-Signal Applications,” IEEE Trans. on Device and Mat. Rel., vol. 9, no. 3, pp. 339-347 (2009)
- M. Gurfinkel, P. Livshits, A. Rozen, J.B. Bernstein, “Local Oscillations of On-Die Supply Voltage-A Reliability Issue,” IEEE Trans. on Device and Mat. Rel., vol. 9, no. 3, pp. 476-482 (2009)
- L. Yang, Joseph B. Bernstein, T. Koschmieder, “Assessment of acceleration models used for BGA solder joint reliability studies,” Microelectronics Reliability Vol. 49, pp. 1546–1554 (2009)
- L. Yang, Joseph B. Bernstein, “Failure rate estimation of known failure mechanisms of electronic packages,” Microelectronics Reliability Vol. 49, pp. 1563-1572 (2009)
- Kuan-Jung Chung and J.B. Bernstein, “Experimental investigation of the optimal laser-induced microbridges,” Precision Engineering, vol. 34, no. 3, pp. 578-585 (2010)
- L. Yang, R. Niu, J. Xie, B. Qian, B. Song, Q. Rong, J.B. Bernstein, “Design-for-reliability implementation in microelectronics packaging development,” Microelectronics International, vol. 28, no. 1, pp. 29-40 (2011)
- B. Huang, M. Rodriguez, M. Li, J.B. Bernstein, C.S. Smidts, “Hardware Error Likelihood Induced by the Operation of Software,” IEEE Trans. on Reliability, vol. 60, no. 3, pp. 622-639 (2011)
- L. Yang and J. Bernstein, “Reliability Evaluation and Modeling of High Density Electronic Packages,” Microelectronics International, vol. 29, no. 1, pp. 15-21 (2012)
Additional Publications and Proceedings:
- Bernstein, J.B., Cohen, S.S., Wyatt, P.W., "Multiple Pulse Effect on Aluminum Thin Films," Proceedings of Conference on Lasers and Electro-Optics, 1991
- Cohen, S.S., Bernstein, J.B., Wyatt, P.W., "Laser-induced line melting and cutting," 50th Annual Device Research Conference, Massachusetts, June 1992
- Johnson, M., Bernstein, J.B., "Practical, Reliable, Hermetic Laser Modification of Metallic Interconnect," Microelectronics Reliability and Qualification Workshop, NASA, California, June 1998
- Stark, B., Bernstein, J.B., Lawton, R., Swift, G., " The Effects of Radiation on the Resonant Frequency of a Polysilicon Microstructure," MEMS Reliability and Qualification Workshop, NASA, California, August 1998
- Bernstein, J.B., "Laser Programmable Interconnections Between Metal Lines," Military and Aerospace Applications of Programmable Devices and Technologies Conference, NASA, September 1998
- Zhang, W., Xie, X., Bernstein, J.B., "Laser-Formed Vertical Metalic Link and Potential Implementation in Digital Logic Integration," Proceedings of MAPLD, September 1999
- Goldsman, N. and Bernstein, J.B., "Robust Design of Wide Band-Gap Power Devices," Proceedings of Advanced Electric Power Systems Conference, Cookeville, TN, May 2002
- Bernstein, J.B., "Electronics Parts Life Extension for Military and Avionic Qualification," Proceedings of Microelectronics Reliability and Qualification Workshop, Manhattan Beach, CA, December 2002.
- Anthony L. Wilson, Ji Luo, Joseph B. Bernstein, J. Ari Tuchman, Hu Huang, Kuan-Jung Chung “A Continuous-Time Laser Programmable Analog Array for Radiation Environments,” Proceedings of MAPLD, September 2004
- J. Qin, B. Huang, J. Walter and J.B. Bernstein, M. Talmor, “Reliability Analysis of Avionics in the Commercial Aerospace Industry,” The Journal of the Reliability Analysis Center, First Quarter, pp. 1-5 (2005)
- Bernstein, J.B., Qin, J. “Physics Based Reliability Qualification,” 16th International Conference of the Israel Society for Quality, Tel Aviv (November 2006)