Publications

Book Authorship and Editorship (chronological order):

  1. Hoang, H.H., Schutz, R., Bernstein, J.B., Vasquez, B., Multilevel Interconnection: Issues that Impact Competitiveness, Proceedings of SPIE 2090, 1993
  2. Pecht, M., Bernstein, J.B., Searls, D., and Peckerar, M., The Korean Electronics Industry, CRC Press, 1997.
  3. Mark White, Joseph B. Bernstein, Microelectronics Reliability Modeling and Lifetime Evaluation Handbook: Derating and Reliability Prediction Guidelines, NASA JPL Publication, 2007
  4. Joseph B. Bernstein et.al, Physics-of-Failure Based Handbook of Microelectronic Systems, Reliability Information Analysis Center, Utica, NY, 2008 ISBN-10: 1-933904-29-1

Book Chapters:

  1. Stark, B., Bernstein, J.B., " Reliability Overview," MEMS Reliability Assurance Guidelines for Space Applications, NASA Publication, 1998
  2. Bernstein, J.B., "Laser Link-Making," in LIA Handbook of Laser Materials Processing, Magnolia Publishing, 2001.

Articles in Refereed Journals:

  1. Bernstein, J.B., “Analysis of the electrically stimulated acoustic-wave method for observing space charge in semi-insulating films," Physical Review B (Condensed Matter), vol.44, no.19, pp. 10804-14 (1991)
  2. Bernstein, J.B., Cooke, C.M., "Bulk space charge behavior in polymethylethacrylate under an imposed virtual cathode condition," IEEE Transactions on Electrical Insulation, vol. 26, no. 6, pp. 1080-6 (1991)
  3. Bernstein, J.B., Cooke, C.M., "Electric poling behavior of polymethylmethacrylate," IEEE Transactions on Electrical Insulation, vol. 26, no. 6, pp. 1087-93 (1991)
  4. Cohen, S.S., Wyatt, P.W., Bernstein, J.B., “Laser-induced melting of thin conducting films. II. Heat-dissipating substrates," IEEE Transactions on Electron Devices, vol.38, no.9 pp. 2051-7 (1991)
  5. Cohen, S.S., Wyatt, P.W., Burns, J.A., Bernstein, J.B., “The mechanism of laser-induced vertical links," Journal of the Electrochemical Society, vol.138, no.10, pp. 3013-18 (1991)
  6. Bernstein, J.B., "Improvements to the Electrically Stimulated Acoustic Wave method for analyzing bulk space charge," IEEE Transactions on Electrical Insulation, vol. 27, no.1, pp. 152-61 (1992)
  7. Bernstein, J.B., Cohen, S.S., Wyatt, P.W., "Metal wire cutting by repeated application of low-power laser pulses," Review of Scientific Instruments, vol. 63, no. 6, pp. 3516-18 (1992)
  8. Cohen, S.S., Bernstein, J.B., Wyatt, P.W., "The effect of multiple laser pluses on damage to thin metallic films," Journal of Applied Physics, vol. 71, no. 2, pp. 630-7 (1992)
  9. Cohen, S.S., Bernstein, J.B., Wyatt, P.W., "Laser-induced line melting and cutting," IEEE Transactions on Electron Devices, vol. 39, no. 11, pp. 2480-5 (1992)
  10. Murguia, J.E., Bernstein, J.B., "Short-time failure of metal interconnect caused by current pulses," IEEE Electron Device Letters, vol. 14, no. 10, pp. 481-3 (1993)
  11. Bernstein, J.B., Ventura, T.M., Radomski, A.I., "High-density laser linking of metal interconnect," IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 17, no.4, pp. 590-3 (1994)
  12. Bernstein, J.B., Ventura, T.M., Radomski, A.T., "Laser induced microfracture leading to high density metal-to-metal connections," Proceedings of the SPIE, The International Society for Optical Engineering, vol. 2335, pp. 165-76 (1995)
  13. Bernstein, J.B., Colella, B.D., "Laser-formed metallic connections employing a lateral link structure," IEEE Transaction on Components, Packaging, and Manufacturing Technology, Part A, vol. 18, no. 3, pp.690-2 (1995)
  14. Shen, Y-L, Suresh, S., Bernstein, J.B., "Laser linking of metal interconnect: analysis and design considerations," IEEE Transactions on Electron Devices, vol. 43, no. 3, pp. 402-10 (1996)
  15. Rasera, R.L., Bernstein, J.B., "Laser linking of metal interconnect: linking dynamics and failure analysis," IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 19, no. 4, pp. 554-61 (1996)
  16. Bernstein, J.B., Hua, Y., Zhang, W., "Laser energy limitation for buried metal cuts," IEEE Electron Device Letters, vol. 19, no. 1, pp. 4-6 (1998)
  17. Bernstein, J.B., Zhang, W., Nicholas, C.H., "Laser formed metallic connections," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 21, no. 2, pp. 194-8 (1998)
  18. Chen, Y., Suehle, J.S., Shen, C.C., Bernstein, J.B., Messick, C., Chaparala, P., "A new technique for determining long-term TDDB acceleration parameters of thin gate oxides," IEEE Electron Device Letters, vol. 19, no. 7, pp. 218-21 (1998)
  19. Zhang, W., Lee, J.H., Chen, Y., Bernstein, J.B., Suehle, J.S., "Reliability of laser-induced metallic vertical links," IEEE Transactions on Advanced Packaging, vol. 22, no.4, pp. 614-19 (1999)
  20. Shen, C.C., Hefner, A.R., Jr., Berning, D.W., Bernstein, J.B., "Failure Dynamics of the IGBT During Turn-off For Unclamped Inductive Loading Conditions," IEEE Transactions on Industry Applications, Vol. 36, no.2, pp.614-24 (2000)
  21. Bernstein, J.B., Lee, J., Yang, G., Dahmas, T., “Analysis of Laser Metal-Cut Energy Process Window," IEEE Transactions on Semiconductor Manufacturing, vol.13, no. 2, pp. 228-34 (2000)
  22. Vogel, E., Suehle, J.S., Edelstein, M.D., Wang, B., Chen, Y., Bernstein, J.B., “Reliability of Ultra-thin Silicon Dioxide Under Combined Substrate Hot Electron and Constant Voltage Tunneling Stress," IEEE Transactions on Electron Devices, vol. 47, no.6, pp.1183-91 (2000)
  23. Lee, J., Zhang, W., Bernstein, J.B., “Scalability Study of Laser-induced Vertical Make-link Structure," IEEE Transactions on Semiconductor Manufacturing, vol. 13, no. 4, pp. 442-447 (2000)
  24. Yang, L., Bernstein, J.B., Chung, K, "The Impact of Lead-free Soldering on Electronics packages," Microelectronics International, vol. 18, no. 3, pp. 20-26 (2001)
  25. Wang, B., Suehle J.S. ,Vogel E.M., Bernstein, J.B., "Time-Dependent Breakdown of Ultra-thin SiO2 Gate Dielectrics under Pulsed Biased Stress," IEEE Electron Device Letters, vol. 22, no. 5, pp. 224-226 (2001)
  26. Zhang, W., J.-H. Lee, Bernstein, J.B, "Energy Effect of the Laser Induced Vertical Metallic Link," IEEE Transactions on Semiconductor Manufacturing, vol. 14, no. 2, pp. 163-169 (2001)
  27. J.F. Conley Jr., J.S. Suehle, A.H. Johnston, B.Wang, T. Miyahara, E.M. Vogel, J.B. Bernstein, "Heavy-Ion Induced soft breakdown of thin gate oxides," IEEE Transactions on Nuclear Science, vol. 48, no. 6, pp. 1913-16 (Dec. 2001)
  28. J.S. Suehle, E.M. Vogel, P. Roitman, J.F. Conley Jr., A.H. Johnston, B. Wang, J.B. Bernstein, and C.E. Weintraub, "Observation of Latent Reliability Degradation in Ultra-Thin Oxides after Heavy-Ion Irradiation," Applied Physics letters, vol. 80, no. 7, pp. 1282-4 (18 Feb 2002)
  29. E.M., Vogel, D. Heh, J.B. Bernstein, "Interaction between low-energy electrons and defects created by hot holes in ultrathin Silicon Dioxide," Applied Physics letters, vol. 80, no. 18, pp. 3343-5 (6 May 2002)
  30. L.-S. Yang and J.B. Bernstein, "Encapsulation Process Development for Flexible-Circuit Based Chip Scale Packages," IEEE Trans. Electronics Packaging Manufacturing, vol. 25, no. 4, pp. 344-354 (October 2002)
  31. L.-S. Yang, J.B. Bernstein and K.C. Leong, "Effect of the Plasma Cleaning Process on Plastic Ball Grid Array Package Assembly Reliability," IEEE Trans. Electronics Packaging Manufacturing, vol. 25, no. 2, pp. 91-99 (April 2002)
  32. E.M., Vogel, D. Heh, J.B. Bernstein, J.S. Suehle, "Impact of the Trapping of Anode Holes in Silicon Dioxide Breakdown," IEEE Electron Device Letters, vol. 23, no. 11, pp. 667-669 (November 2002)
  33. J. Lee, W. Zhang, J.B Bernstein, "Analysis of Energy Process Window of Laser Metal Pad Cut Link Structure," IEEE Transactions on Semiconductor Manufacturing, vol. 16, no. 2, pp. 299-307 (2003)
  34. L. Yang, C.K. King, J.B. Bernstein, “Liquid Dispensing Encapsulation in Semiconductor Packaging,” Microelectronics International, vol. 20, no. 3, pp. 29-35 (2003)
  35. D.W. Heh, E.M. Vogel, J.B. Bernstein, “Impact of Substrate Hot Hole Injection on Ultra-thin Silicon-dioxide Breakdown, ”Applied Physics Letters, vol. 82, no. 19, pp. 3242-3244 (2003)
  36. J.S. Suehle, B. Zhu, Y. Chen and J.B. Bernstein, “Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides,” Microelectronics Reliability, vol. 45, pp. 419-426 (2005)
  37. Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, J?rg Walters, Yoram Shapira and Michael Talmor, “Electronic circuit reliability modeling,” Microelectronics Reliability, vol. 46, pp. 1957-1979 (2006)
  38. Heh D, Young CD, Brown GA, Hung PY, Diebold A, Bersuker G, Vogel EM, Bernstein JB, “Spatial distributions of trapping centers in HfO2/SiO2 gate stacks,” Applied Physics Letters, vol. 88, no.15, pp. 152907 (2006)
  39. X. Li, J. Qin, B. Huang, X. Zhang, and J.B. Bernstein, “SRAM Circuit Failure Modeling and Reliability Simulation with SPICE,” IEEE Trans. on Device and Mat. Rel., vol. 6, no. 2, pp.235-246 (2006)
  40. X. Li, J. Qin, B. Huang, X. Zhang, and J.B. Bernstein, “A New SPICE Reliability Simulation Method for Deep Submicron VLSI Circuits,” IEEE Trans. on Device and Mat. Rel., vol. 6, no. 2, pp. 247-257 (2006)
  41. D. Heh, C.D. Young, G.A. Brown, P.Y. Hung, A. Diebold, E. Vogel, J.B. Bernstein, and G. Bersuker, “Spatial Distributions of Trapping Centers in Hf02/SiO2 Gate Stack," IEEE Transactions on Electron Devices, vol. 54, no.6, pp. 1338-45 (2007)
  42. X. Li, J. Qin, and J.B. Bernstein, “Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation,” IEEE Trans. on Device and Mat. Rel., vol. 8, no. 1, pp. 98-121 (2008)
  43. M. Gurfinkel, H.D. Xiong, K.P. Cheung, J.S. Suehle, J.B. Bernstein, Y. Shapira, A.J. Lelis, D. Habersat, N. Goldsman, “Characterization of Transient Gate Oxide Trapping in SiC MOSFETs Using Fast I-V Techniques,” IEEE Transactions on Electron Devices, vol. 55, no.8, pp. 2004-12 (2008)
  44. L. Yang, J.B. Bernstein, "Reliability Study of High-Density EBGA Packages Using the Cu Metalized Silicon," IEEE Transaction on Components and Packaging Technology, vol. 31, no. 3, pp. 702-11 (2008)
  45. M. Gurfinkel, J.C. Horst, J.S. Suehle, J.B. Bernstein, Y. Shapira, K.S. Matocha, G. Dunne, R.A. Beaupre, “Time-Dependent Dielectric Breakdown of 4H-SiC/SiO2 MOS Capacitors,” IEEE Trans. on Device and Mat. Rel., vol. 8, no. 4, pp. 635-641 (2008)
  46. B. Yan, J. Qin, J. Dai, Q. Fan, and J.B. Bernstein, “Reliability Simulation and Circuit-Failure Analysis in Analog and Mixed-Signal Applications,” IEEE Trans. on Device and Mat. Rel., vol. 9, no. 3, pp. 339-347 (2009)
  47. M. Gurfinkel, P. Livshits, A. Rozen, J.B. Bernstein, “Local Oscillations of On-Die Supply Voltage-A Reliability Issue,” IEEE Trans. on Device and Mat. Rel., vol. 9, no. 3, pp. 476-482 (2009)
  48. L. Yang, Joseph B. Bernstein, T. Koschmieder, “Assessment of acceleration models used for BGA solder joint reliability studies,” Microelectronics Reliability Vol. 49, pp. 1546–1554 (2009)
  49. L. Yang, Joseph B. Bernstein, “Failure rate estimation of known failure mechanisms of electronic packages,” Microelectronics Reliability Vol. 49, pp. 1563-1572 (2009)
  50. Kuan-Jung Chung and J.B. Bernstein, “Experimental investigation of the optimal laser-induced microbridges,” Precision Engineering, vol. 34, no. 3, pp. 578-585 (2010)
  51. L. Yang, R. Niu, J. Xie, B. Qian, B. Song, Q. Rong, J.B. Bernstein, “Design-for-reliability implementation in microelectronics packaging development,” Microelectronics International, vol. 28, no. 1, pp. 29-40 (2011)
  52. B. Huang, M. Rodriguez, M. Li, J.B. Bernstein, C.S. Smidts, “Hardware Error Likelihood Induced by the Operation of Software,” IEEE Trans. on Reliability, vol. 60, no. 3, pp. 622-639 (2011)
  53. L. Yang and J. Bernstein, “Reliability Evaluation and Modeling of High Density Electronic Packages,” Microelectronics International, vol. 29, no. 1, pp. 15-21 (2012)

Additional Publications and Proceedings:

  1. Bernstein, J.B., Cohen, S.S., Wyatt, P.W., "Multiple Pulse Effect on Aluminum Thin Films," Proceedings of Conference on Lasers and Electro-Optics, 1991
  2. Cohen, S.S., Bernstein, J.B., Wyatt, P.W., "Laser-induced line melting and cutting," 50th Annual Device Research Conference, Massachusetts, June 1992
  3. Johnson, M., Bernstein, J.B., "Practical, Reliable, Hermetic Laser Modification of Metallic Interconnect," Microelectronics Reliability and Qualification Workshop, NASA, California, June 1998
  4. Stark, B., Bernstein, J.B., Lawton, R., Swift, G., " The Effects of Radiation on the Resonant Frequency of a Polysilicon Microstructure," MEMS Reliability and Qualification Workshop, NASA, California, August 1998
  5. Bernstein, J.B., "Laser Programmable Interconnections Between Metal Lines," Military and Aerospace Applications of Programmable Devices and Technologies Conference, NASA, September 1998
  6. Zhang, W., Xie, X., Bernstein, J.B., "Laser-Formed Vertical Metalic Link and Potential Implementation in Digital Logic Integration," Proceedings of MAPLD, September 1999
  7. Goldsman, N. and Bernstein, J.B., "Robust Design of Wide Band-Gap Power Devices," Proceedings of Advanced Electric Power Systems Conference, Cookeville, TN, May 2002
  8. Bernstein, J.B., "Electronics Parts Life Extension for Military and Avionic Qualification," Proceedings of Microelectronics Reliability and Qualification Workshop, Manhattan Beach, CA, December 2002.
  9. Anthony L. Wilson, Ji Luo, Joseph B. Bernstein, J. Ari Tuchman, Hu Huang, Kuan-Jung Chung “A Continuous-Time Laser Programmable Analog Array for Radiation Environments,” Proceedings of MAPLD, September 2004
  10. J. Qin, B. Huang, J. Walter and J.B. Bernstein, M. Talmor, “Reliability Analysis of Avionics in the Commercial Aerospace Industry,” The Journal of the Reliability Analysis Center, First Quarter, pp. 1-5 (2005)
  11. Bernstein, J.B., Qin, J. “Physics Based Reliability Qualification,” 16th International Conference of the Israel Society for Quality, Tel Aviv (November 2006)