Patents and Trademarks:

• Bernstein, JB, Gershman, I, “Solder joint life measurement for prognostics,” Application in process.
• Bernstein, JB. Zhang, Z. Laser-Induced Cutting of Metal Interconnect, #6,057,221,
• Bernstein, JB. Interconnecting Conductive Links, #6,541,868,
• Bernstein, JB MAKELINK, US trademark #2688978, Typed, registered February 18, 2003
• Bernstein, JB. Technique for Producing Interconnecting Conductive Links, #5,920,727
• Bernstein, JB. Technique for Producing Interconnecting Conductive Links, #5,920,789
• Bernstein, JB.Technique for Producing Interconnecting Conductive Links, #5,861,325
• Bernstein, JB. Structure for Providing One or More Conductive Paths, #5,585,602