{"id":14,"date":"2012-05-09T13:25:16","date_gmt":"2012-05-09T10:25:16","guid":{"rendered":"http:\/\/www.eng.biu.ac.il\/bernstj\/?page_id=14"},"modified":"2013-08-11T15:36:55","modified_gmt":"2013-08-11T12:36:55","slug":"publications","status":"publish","type":"page","link":"https:\/\/www.eng.biu.ac.il\/bernstj\/publications\/","title":{"rendered":"Publications"},"content":{"rendered":"

Book Authorship and Editorship (chronological order):<\/strong><\/p>\n

    \n
  1. Hoang, H.H., Schutz, R., Bernstein, J.B., Vasquez, B., Multilevel Interconnection: Issues that Impact Competitiveness, Proceedings of SPIE 2090, 1993<\/li>\n
  2. Pecht, M., Bernstein, J.B., Searls, D., and Peckerar, M., The Korean Electronics Industry, CRC Press, 1997.<\/li>\n
  3. Mark White, Joseph B. Bernstein, Microelectronics Reliability Modeling and Lifetime Evaluation Handbook: Derating and Reliability Prediction Guidelines, NASA JPL Publication, 2007<\/li>\n
  4. Joseph B. Bernstein et.al, Physics-of-Failure Based Handbook of Microelectronic Systems, Reliability Information Analysis Center, Utica, NY, 2008 \t\tISBN-10: 1-933904-29-1<\/li>\n<\/ol>\n

    Book Chapters:<\/strong><\/p>\n

      \n
    1. Stark, B., Bernstein, J.B., \" Reliability Overview,\" MEMS Reliability Assurance Guidelines for Space Applications, NASA Publication, 1998<\/li>\n
    2. Bernstein, J.B., \"Laser Link-Making,\" in LIA Handbook of Laser Materials Processing, Magnolia Publishing, 2001.<\/li>\n<\/ol>\n

      Articles in Refereed Journals:<\/strong><\/p>\n

        \n
      1. Bernstein, J.B., \u201cAnalysis of the electrically stimulated acoustic-wave method for observing space charge in semi-insulating films,\" Physical Review B (Condensed Matter), vol.44, no.19, pp. 10804-14 (1991)<\/li>\n
      2. Bernstein, J.B., Cooke, C.M., \"Bulk space charge behavior in polymethylethacrylate under an imposed virtual cathode condition,\" IEEE Transactions on Electrical Insulation, vol. 26, no. 6, pp. 1080-6 (1991)<\/li>\n
      3. Bernstein, J.B., Cooke, C.M., \"Electric poling behavior of polymethylmethacrylate,\" IEEE Transactions on Electrical Insulation, vol. 26, no. 6, pp. 1087-93 (1991)<\/li>\n
      4. Cohen, S.S., Wyatt, P.W., Bernstein, J.B., \u201cLaser-induced melting of thin conducting films. II. Heat-dissipating substrates,\" IEEE Transactions on Electron Devices, vol.38, no.9 pp. 2051-7 (1991)<\/li>\n
      5. Cohen, S.S., Wyatt, P.W., Burns, J.A., Bernstein, J.B., \u201cThe mechanism of laser-induced vertical links,\" Journal of the Electrochemical Society, vol.138, no.10, pp. 3013-18 (1991)<\/li>\n
      6. Bernstein, J.B., \"Improvements to the Electrically Stimulated Acoustic Wave method for analyzing bulk space charge,\" IEEE Transactions on Electrical Insulation, vol. 27, no.1, pp. 152-61 (1992)<\/li>\n
      7. Bernstein, J.B., Cohen, S.S., Wyatt, P.W., \"Metal wire cutting by repeated application of low-power laser pulses,\" Review of Scientific Instruments, vol. 63, no. 6, pp. 3516-18 (1992)<\/li>\n
      8. Cohen, S.S., Bernstein, J.B., Wyatt, P.W., \"The effect of multiple laser pluses on damage to thin metallic films,\" Journal of Applied Physics, vol. 71, no. 2, pp. 630-7 (1992)<\/li>\n
      9. Cohen, S.S., Bernstein, J.B., Wyatt, P.W., \"Laser-induced line melting and cutting,\" IEEE Transactions on Electron Devices, vol. 39, no. 11, pp. 2480-5 (1992)<\/li>\n
      10. Murguia, J.E., Bernstein, J.B., \"Short-time failure of metal interconnect caused by current pulses,\" IEEE Electron Device Letters, vol. 14, no. 10, pp. 481-3 (1993)<\/li>\n
      11. Bernstein, J.B., Ventura, T.M., Radomski, A.I., \"High-density laser linking of metal interconnect,\" IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 17, no.4, pp. 590-3 (1994)<\/li>\n
      12. Bernstein, J.B., Ventura, T.M., Radomski, A.T., \"Laser induced microfracture leading to high density metal-to-metal connections,\" Proceedings of the SPIE, The International Society for Optical Engineering, vol. 2335, pp. 165-76 (1995)<\/li>\n
      13. Bernstein, J.B., Colella, B.D., \"Laser-formed metallic connections employing a lateral link structure,\" IEEE Transaction on Components, Packaging, and Manufacturing Technology, Part A, vol. 18, no. 3, pp.690-2 (1995)<\/li>\n
      14. Shen, Y-L, Suresh, S., Bernstein, J.B., \"Laser linking of metal interconnect: analysis and design considerations,\" IEEE Transactions on Electron Devices, vol. 43, no. 3, pp. 402-10 (1996)<\/li>\n
      15. Rasera, R.L., Bernstein, J.B., \"Laser linking of metal interconnect: linking dynamics and failure analysis,\" IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 19, no. 4, pp. 554-61 (1996)<\/li>\n
      16. Bernstein, J.B., Hua, Y., Zhang, W., \"Laser energy limitation for buried metal cuts,\" IEEE Electron Device Letters, vol. 19, no. 1, pp. 4-6 (1998)<\/li>\n
      17. Bernstein, J.B., Zhang, W., Nicholas, C.H., \"Laser formed metallic connections,\" IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 21, no. 2, pp. 194-8 (1998)<\/li>\n
      18. Chen, Y., Suehle, J.S., Shen, C.C., Bernstein, J.B., Messick, C., Chaparala, P., \"A new technique for determining long-term TDDB acceleration parameters of thin gate oxides,\" IEEE Electron Device Letters, vol. 19, no. 7, pp. 218-21 (1998)<\/li>\n
      19. Zhang, W., Lee, J.H., Chen, Y., Bernstein, J.B., Suehle, J.S., \"Reliability of laser-induced metallic vertical links,\" IEEE Transactions on Advanced Packaging, vol. 22, no.4, pp. 614-19 (1999)<\/li>\n
      20. Shen, C.C., Hefner, A.R., Jr., Berning, D.W., Bernstein, J.B., \"Failure Dynamics of the IGBT During Turn-off For Unclamped Inductive Loading Conditions,\" IEEE Transactions on Industry Applications, Vol. 36, no.2, pp.614-24 (2000)<\/li>\n
      21. Bernstein, J.B., Lee, J., Yang, G., Dahmas, T., \u201cAnalysis of Laser Metal-Cut Energy Process Window,\" IEEE Transactions on Semiconductor Manufacturing, vol.13, no. 2, pp. 228-34 (2000)<\/li>\n
      22. Vogel, E., Suehle, J.S., Edelstein, M.D., Wang, B., Chen, Y., Bernstein, J.B., \u201cReliability of Ultra-thin Silicon Dioxide Under Combined Substrate Hot Electron and Constant Voltage Tunneling Stress,\" IEEE Transactions on Electron Devices, vol. 47, no.6, pp.1183-91 (2000)<\/li>\n
      23. Lee, J., Zhang, W., Bernstein, J.B., \u201cScalability Study of Laser-induced Vertical Make-link Structure,\" IEEE Transactions on Semiconductor Manufacturing, vol. 13, no. 4, pp. 442-447 (2000)<\/li>\n
      24. Yang, L., Bernstein, J.B., Chung, K, \"The Impact of Lead-free Soldering on Electronics packages,\" Microelectronics International, vol. 18, no. 3, pp. 20-26 (2001)<\/li>\n
      25. Wang, B., Suehle J.S. ,Vogel E.M., Bernstein, J.B., \"Time-Dependent Breakdown of Ultra-thin SiO2 Gate Dielectrics under Pulsed Biased Stress,\" IEEE Electron Device Letters, vol. 22, no. 5, pp. 224-226 (2001)<\/li>\n
      26. Zhang, W., J.-H. Lee, Bernstein, J.B, \"Energy Effect of the Laser Induced Vertical Metallic Link,\" IEEE Transactions on Semiconductor Manufacturing, vol. 14, no. 2, pp. 163-169 (2001)<\/li>\n
      27. J.F. Conley Jr., J.S. Suehle, A.H. Johnston, B.Wang, T. Miyahara, E.M. Vogel, J.B. Bernstein, \"Heavy-Ion Induced soft breakdown of thin gate oxides,\" IEEE Transactions on Nuclear Science, vol. 48, no. 6, pp. 1913-16 (Dec. 2001)<\/li>\n
      28. J.S. Suehle, E.M. Vogel, P. Roitman, J.F. Conley Jr., A.H. Johnston, B. Wang, J.B. Bernstein, and C.E. Weintraub, \"Observation of Latent Reliability Degradation in Ultra-Thin Oxides after Heavy-Ion Irradiation,\" Applied Physics letters, vol. 80, no. 7, pp. 1282-4 (18 Feb 2002)<\/li>\n
      29. E.M., Vogel, D. Heh, J.B. Bernstein, \"Interaction between low-energy electrons and defects created by hot holes in ultrathin Silicon Dioxide,\" Applied Physics letters, vol. 80, no. 18, pp. 3343-5 (6 May 2002)<\/li>\n
      30. L.-S. Yang and J.B. Bernstein, \"Encapsulation Process Development for Flexible-Circuit Based Chip Scale Packages,\" IEEE Trans. Electronics Packaging Manufacturing, vol. 25, no. 4, pp. 344-354 (October 2002)<\/li>\n
      31. L.-S. Yang, J.B. Bernstein and K.C. Leong, \"Effect of the Plasma Cleaning Process on Plastic Ball Grid Array Package Assembly Reliability,\" IEEE Trans. Electronics Packaging Manufacturing, vol. 25, no. 2, pp. 91-99 (April 2002)<\/li>\n
      32. E.M., Vogel, D. Heh, J.B. Bernstein, J.S. Suehle, \"Impact of the Trapping of Anode Holes in Silicon Dioxide Breakdown,\" IEEE Electron Device Letters, vol. 23, no. 11, pp. 667-669 (November 2002)<\/li>\n
      33. J. Lee, W. Zhang, J.B Bernstein, \"Analysis of Energy Process Window of Laser Metal Pad Cut Link Structure,\" IEEE Transactions on Semiconductor Manufacturing, vol. 16, no. 2, pp. 299-307 (2003)<\/li>\n
      34. L. Yang, C.K. King, J.B. Bernstein, \u201cLiquid Dispensing Encapsulation in Semiconductor Packaging,\u201d Microelectronics International, vol. 20, no. 3, pp. 29-35 (2003)<\/li>\n
      35. D.W. Heh, E.M. Vogel, J.B. Bernstein, \u201cImpact of Substrate Hot Hole Injection on Ultra-thin Silicon-dioxide Breakdown, \u201dApplied Physics Letters, vol. 82, no. 19, pp. 3242-3244 (2003)<\/li>\n
      36. J.S. Suehle, B. Zhu, Y. Chen and J.B. Bernstein, \u201cDetailed study and projection of hard breakdown evolution in ultra-thin gate oxides,\u201d Microelectronics Reliability, vol. 45, pp. 419-426 (2005)<\/li>\n
      37. Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, J?rg Walters, Yoram Shapira and Michael Talmor, \u201cElectronic circuit reliability modeling,\u201d Microelectronics Reliability, vol. 46, pp. 1957-1979 (2006)<\/li>\n
      38. Heh D, Young CD, Brown GA, Hung PY, Diebold A, Bersuker G, Vogel EM, Bernstein JB, \u201cSpatial distributions of trapping centers in HfO2\/SiO2 gate stacks,\u201d Applied Physics Letters, vol. 88, no.15, pp. 152907 (2006)<\/li>\n
      39. X. Li, J. Qin, B. Huang, X. Zhang, and J.B. Bernstein, \u201cSRAM Circuit Failure Modeling and Reliability Simulation with SPICE,\u201d IEEE Trans. on Device and Mat. Rel., vol. 6, no. 2, pp.235-246 (2006)<\/li>\n
      40. X. Li, J. Qin, B. Huang, X. Zhang, and J.B. Bernstein, \u201cA New SPICE Reliability Simulation Method for Deep Submicron VLSI Circuits,\u201d IEEE Trans. on Device and Mat. Rel., vol. 6, no. 2, pp. 247-257 (2006)<\/li>\n
      41. D. Heh, C.D. Young, G.A. Brown, P.Y. Hung, A. Diebold, E. Vogel, J.B. Bernstein, and G. Bersuker, \u201cSpatial Distributions of Trapping Centers in Hf02\/SiO2 Gate Stack,\" IEEE Transactions on Electron Devices, vol. 54, no.6, pp. 1338-45 (2007)<\/li>\n
      42. X. Li, J. Qin, and J.B. Bernstein, \u201cCompact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation,\u201d IEEE Trans. on Device and Mat. Rel., vol. 8, no. 1, pp. 98-121 (2008)<\/li>\n
      43. M. Gurfinkel, H.D. Xiong, K.P. Cheung, J.S. Suehle, J.B. Bernstein, Y. Shapira, A.J. Lelis, D. Habersat, N. Goldsman, \u201cCharacterization of Transient Gate Oxide Trapping in SiC MOSFETs Using Fast I-V Techniques,\u201d IEEE Transactions on Electron Devices, vol. 55, no.8, pp. 2004-12 (2008)<\/li>\n
      44. L. Yang, J.B. Bernstein, \"Reliability Study of High-Density EBGA Packages Using the Cu Metalized Silicon,\" IEEE Transaction on Components and Packaging Technology, vol. 31, no. 3, pp. 702-11 (2008)<\/li>\n
      45. M. Gurfinkel, J.C. Horst, J.S. Suehle, J.B. Bernstein, Y. Shapira, K.S. Matocha, G. Dunne, R.A. Beaupre, \u201cTime-Dependent Dielectric Breakdown of 4H-SiC\/SiO2 MOS Capacitors,\u201d IEEE Trans. on Device and Mat. Rel., vol. 8, no. 4, pp. 635-641 (2008)<\/li>\n
      46. B. Yan, J. Qin, J. Dai, Q. Fan, and J.B. Bernstein, \u201cReliability Simulation and Circuit-Failure Analysis in Analog and Mixed-Signal Applications,\u201d IEEE Trans. on Device and Mat. Rel., vol. 9, no. 3, pp. 339-347 (2009)<\/li>\n
      47. M. Gurfinkel, P. Livshits, A. Rozen, J.B. Bernstein, \u201cLocal Oscillations of On-Die Supply Voltage-A Reliability Issue,\u201d IEEE Trans. on Device and Mat. Rel., vol. 9, no. 3, pp. 476-482 (2009)<\/li>\n
      48. L. Yang, Joseph B. Bernstein, T. Koschmieder, \u201cAssessment of acceleration models used for BGA solder joint reliability studies,\u201d Microelectronics Reliability Vol. 49, pp. 1546\u20131554 (2009)<\/li>\n
      49. L. Yang, Joseph B. Bernstein, \u201cFailure rate estimation of known failure mechanisms of electronic packages,\u201d Microelectronics Reliability Vol. 49, pp. 1563-1572 (2009)<\/li>\n
      50. Kuan-Jung Chung and J.B. Bernstein, \u201cExperimental investigation of the optimal laser-induced microbridges,\u201d Precision Engineering, vol. 34, no. 3, pp. 578-585 (2010)<\/li>\n
      51. L. Yang, R. Niu, J. Xie, B. Qian, B. Song, Q. Rong, J.B. Bernstein, \u201cDesign-for-reliability implementation in microelectronics packaging development,\u201d Microelectronics International, vol. 28, no. 1, pp. 29-40 (2011)<\/li>\n
      52. B. Huang, M. Rodriguez, M. Li, J.B. Bernstein, C.S. Smidts, \u201cHardware Error Likelihood Induced by the Operation of Software,\u201d IEEE Trans. on Reliability, vol. 60, no. 3, pp. 622-639 (2011)<\/li>\n
      53. L. Yang and J. Bernstein, \u201cReliability Evaluation and Modeling of High Density Electronic Packages,\u201d Microelectronics International, vol. 29, no. 1, pp. 15-21 (2012)<\/li>\n<\/ol>\n

        Additional Publications and Proceedings:<\/strong><\/p>\n

          \n
        1. Bernstein, J.B., Cohen, S.S., Wyatt, P.W., \"Multiple Pulse Effect on Aluminum Thin Films,\" Proceedings of Conference on Lasers and Electro-Optics, 1991<\/li>\n
        2. Cohen, S.S., Bernstein, J.B., Wyatt, P.W., \"Laser-induced line melting and cutting,\" 50th Annual Device Research Conference, Massachusetts, June 1992<\/li>\n
        3. Johnson, M., Bernstein, J.B., \"Practical, Reliable, Hermetic Laser Modification of Metallic Interconnect,\" Microelectronics Reliability and Qualification Workshop, NASA, California, June 1998<\/li>\n
        4. Stark, B., Bernstein, J.B., Lawton, R., Swift, G., \" The Effects of Radiation on the Resonant Frequency of a Polysilicon Microstructure,\" MEMS Reliability and Qualification Workshop, NASA, California, August 1998<\/li>\n
        5. Bernstein, J.B., \"Laser Programmable Interconnections Between Metal Lines,\" Military and Aerospace Applications of Programmable Devices and Technologies Conference, NASA, September 1998<\/li>\n
        6. Zhang, W., Xie, X., Bernstein, J.B., \"Laser-Formed Vertical Metalic Link and Potential Implementation in Digital Logic Integration,\" Proceedings of MAPLD, September 1999<\/li>\n
        7. Goldsman, N. and Bernstein, J.B., \"Robust Design of Wide Band-Gap Power Devices,\" Proceedings of Advanced Electric Power Systems Conference, Cookeville, TN, May 2002<\/li>\n
        8. Bernstein, J.B., \"Electronics Parts Life Extension for Military and Avionic Qualification,\" Proceedings of Microelectronics Reliability and Qualification Workshop, Manhattan Beach, CA, December 2002.<\/li>\n
        9. Anthony L. Wilson, Ji Luo, Joseph B. Bernstein, J. Ari Tuchman, Hu Huang, Kuan-Jung Chung \u201cA Continuous-Time Laser Programmable Analog Array for Radiation Environments,\u201d Proceedings of MAPLD, September 2004<\/li>\n
        10. J. Qin, B. Huang, J. Walter and J.B. Bernstein, M. Talmor, \u201cReliability Analysis of Avionics in the Commercial Aerospace Industry,\u201d The Journal of the Reliability Analysis Center, First Quarter, pp. 1-5 (2005)<\/li>\n
        11. Bernstein, J.B., Qin, J. \u201cPhysics Based Reliability Qualification,\u201d 16th International Conference of the Israel Society for Quality, Tel Aviv (November 2006)<\/li>\n<\/ol>\n","protected":false},"excerpt":{"rendered":"

          Book Authorship and Editorship (chronological order): Hoang, H.H., Schutz, R., Bernstein, J.B., Vasquez, B., Multilevel Interconnection: Issues that Impact Competitiveness, Proceedings of SPIE 2090, 1993 Pecht, M., Bernstein, J.B., Searls, D., and Peckerar, M., The Korean Electronics Industry, CRC Press, 1997. Mark White, Joseph B. Bernstein, Microelectronics Reliability Modeling and Lifetime Evaluation Handbook: Derating and … Continue reading Publications<\/span> →<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"open","template":"onecolumn-page.php","meta":{"footnotes":""},"class_list":["post-14","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.eng.biu.ac.il\/bernstj\/wp-json\/wp\/v2\/pages\/14"}],"collection":[{"href":"https:\/\/www.eng.biu.ac.il\/bernstj\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.eng.biu.ac.il\/bernstj\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.eng.biu.ac.il\/bernstj\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.eng.biu.ac.il\/bernstj\/wp-json\/wp\/v2\/comments?post=14"}],"version-history":[{"count":7,"href":"https:\/\/www.eng.biu.ac.il\/bernstj\/wp-json\/wp\/v2\/pages\/14\/revisions"}],"predecessor-version":[{"id":48,"href":"https:\/\/www.eng.biu.ac.il\/bernstj\/wp-json\/wp\/v2\/pages\/14\/revisions\/48"}],"wp:attachment":[{"href":"https:\/\/www.eng.biu.ac.il\/bernstj\/wp-json\/wp\/v2\/media?parent=14"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}